Hoenle introduces a blue fluorescent polyacrylate sealing material specifically engineered for high performance electronic housings in automotive and e-mobility applications: Vitralit CIPG 60200.
The company will be focusing on how users can utilise miniature, tight-tolerance plastic components in and around fibre optic connectivity and photonics-enabled hardware.
Intertronics presents a new adhesive for ruggedising and staking critical electronic components onto printed circuit boards (PCB) for the aerospace and defence sectors: Dymax 9773.
Fairgrieve Compression Moulding has reported a 52% sales increase in 2025 – which combined with doubling the size of its team has left it targeting similar growth and success in 2026.
Jochen Apfel, CEO of weeeSwiss Technology AG, shares insights on technology, safety, and the role advanced process engineering plays in the circular economy of tomorrow.
The patents are set to advance dielectric film technology across power grids, electric vehicles, fusion energy, aerospace, packaging, and defence applications.
